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集成电路封装材料的表征 / 材料表征原版系列丛书

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作者： (美)布伦德尔埃文斯摩尔

出版时间：2014年1月

出版社：哈尔滨工业大学

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基本信息评价

出版社：哈尔滨工业大学
ISBN：9787560342825
图书编号：96887
出版时间：2014年1月
学科分类1：未分类
学科分类2：未分类
中图分类编号：TN405

内容简介

　　《集成电路封装材料的表征(英文)》的主要内容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。

Foreword

Preface to the Reissue of the Materials Characterization Series

Preface to Series xiv

Preface to the Reissue of Integrated Circuit Packaging Materials

Preface

Contributors

IC PACKAGE RELIABILITY TESTING

　 1.1 Introduction

　 1.2 In-Process Quality Measurements

　　　　 Wire Bond Quality 3, Die Attach Quality 4, Other Process Control Measurements 8

　 1.3 Package-Oriented Reliability Testing of Finished Devices: Moisture Testing

　　　　 Failure Analysis of Moisture-Related Failures 11, Root Causes of Corrosion Failures

　 1.4 Package-Oriented Reliability Testing of Finished Devices: Thermal Cycle Testing

　　　　 Bond Failures: Bond Pad Contamination 16, Intermetallic Formation

　　　　 and Other Elements of Bond Formation

　 1.5 Reliability Test Preconditioning: A New Direction

　 1.6 Summary

MOLD COMPOUND ADHESION AND STRENGTH

MECHANICAL STRESS IN IC PACKAGES

MOISTURE SENSITIVITY AND DELAMINATION

THERMAL MANAGEMENT

ELECTRICAL PERFORMANCE OF IC PACKAGES

SOLDERABILITY OF INTEGRATED CIRCUITS

HERMETICITY AND JOINING IN CERAMIC IC PACKAGES

ADVANCED INTERCONNECT TECHNOLOGY

APPENDIX: TECHNIQUE SUMMARIES