Preface to the Reissue of the Materials Characterization Series

Preface to Series

Preface to the Reissue of Characterization in Silicon Processing

Preface

Contributors

APPLICATION OF MATERIALS CHARACTERIZATION TECHNIQUES TO SILICON EPITAXIAL GROWTH

　1.1 Introduction

　1.2 Silicon Epitaxial Growth

　1.3 Film and Process Characterization

　1.4 Selective Growth

　1.5 Si1_xGex Epitaxial Growth

　1.6 Si1_ xGex Material Characterization

　1.7 Summary

POLYSILICON CONDUCTORS

　2.1 Introduction

　2.2 Deposition

　2.3 Doping

　2.4 Patterning

　2.5 Subsequent Processing

SILICIDES

　3.1 Introduction

　3.2 Formation of Silicides

　3.3 The Silicide-Silicon Interface

　3.4 Oxidation of Silicides

　3.5 Dopant Redistribution During Silicide Formation

　3.6 Stress in Silicides

　3.7 Stability of Silicides

　3.8 Summary

ALUMINUM- AND COPPER-BASED CONDUCTORS

　4.1 Introduction

　4.2 Film Deposition

　4.3 Film Growth

　4.4 Encapsulation

　4.5 Reliability Concerns

TUNGSTEN-BASED CONDUCTORS

　5.1 Applications for ULSI Processing

　5.2 Deposition Principles

　5.3 Blanket Tungsten Deposition

　5.4 Selective Tungsten Deposition

BARRIER FILMS

　6.1 Introduction

　6.2 Characteristics of Barrier Films

　6.3 Types of Barrier Films

　6.4 Processing Barrier Films

　6.5 Examples of Barrier Films

　6.6 Summary

APPENDIX: TECHNIQUE SUMMARIES

　1 Auger Electron Spectroscopy (AES)

　2 Ballistic Electron Emission Microscopy (BEEM)

　3 Capacitance-Voltage (C-V) Measurements

　4 Deep Level Transient Spectroscopy (DLTS)

　5 Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)

　6 Electron Beam Induced Current (EBIC) Microscopy

　7 Energy-Dispersive X-Ray Spectroscopy (EDS)

　8 Focused Ion Beams (FIBs)

　9 Fourier Transform Infrared Spectroscopy (FTIR)

　10 Hall Effect Resistivity Measurements

　11 Inductively Coupled Plasma Mass Spectrometry (ICPMS)

　12 Light Microscopy

　13 Low-Energy Electron Diffraction (LEED)

　14 Neutron Activation Analysis (NAA)

　15 Optical Scatterometry

　16 Photoluminescence (PL)

　17 Raman Spectroscopy

　18 Reflection High-Energy Electron Diffraction (RHEED)

　19 Rutherford Backscattering Spectrometry (RBS)

　20 Scanning Electron Microscopy (SEM)

　21 Scanning Transmission Electron Microscopy (STEM)

　22 Scanning Tunneling Microscopy and Scanning Force Microscopy (STM and SFM)

　23 Sheet Resistance and the Four Point Probe

　24 Spreading Resistance Analysis (SRA)

　25 Static Secondary Ion Mass Spectrometry (Static SIMS)

　26 Surface Roughness: Measurement, Formation by Sputtering, Impact on Depth Profiling

　27 Total Reflection X-Ray Fluorescence Analysis (TXRF)

　28 Transmission Electron Microscopy (TEM)

　29 Variable-Angle Spectroscopic Ellipsometry (VASE)

　30 X-Ray Diffraction (XRD)

　31 X-Ray Fluorescence (XRF)

　32 X-Ray Photoelectron Spectroscopy (XPS)

Index